MARTVIEW RB-01 BGA Reballing Platform

RB-01 Reballing Stencil Tin Net Full Set for EMMC / EMCP / UFS.

How it works

Advantages

• High precision and precise alignment. Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints.
• Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape.
• Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid, and anti-scald so that the tin planting position is more stable.
• Double magnet ensures accurate positioning without shaking.

Features

• Support for EMMC / EMCP / UFS:
  • BGA153, BGA162, BGA169, BGA186, BGA221, BGA254

Specifications

• Fixing plate and holder included.
• Stencil net thickness: 0.15 mm
• Support IC size: 11.5 x 13 mm, 12 x 16 mm
• Holder size: 80 x 80 x 15 mm
• Packing size: 89 x 89 x 32 mm

Package Contents:

• Stencils - 6 pcs.
• Adjustment frame - 2 pcs.
• Adjustment piece - 2 pcs.
• Tin scraper - 1 pc.
• Fixed plate - 1 pc.
• Holder - 1 pc.