MARTVIEW RB-03 Universal BGA Reballing Platform

This holder with stencil net set is intended for reballing of 99% ICs on the market such as A8-A17 for iPhone 6 up to 15 series, as well as Qualcomm Snapdragon, Hisilicon Kirin, MTK Dimensity, and Samsung Exynos series.

How it works

Features

• Suitable for 99% ICs on the market
• Fast automatic adjustment button and magnet
• High positioning accuracy and precision for adjusting the chip, magnet inside, auto fix, more fast and convenient
• Made of high-quality materials, dirt-resistant, easy to clean.
• Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• Maximum supported chip size: 45 mm x 45 mm
• Minimum supported chip size: 1.6 mm x 1.6 mm
• Holder size: 70 x 70 x 24 mm
• Packing size: 177 x 91 x 26 mm

Functions Introduction

• A built-in knob adjusts the lateral movement of the chip holder module, moving it inward or outward simultaneously.
• A built-in large turntable adjusts the longitudinal movement of the two chip holder modules, moving them inward or outward simultaneously.
• Built-in four lifting screws are designed to adjust the height of the stencil-positioning module, making it suitable for chip bead planting and tin scraping of different thicknesses.
• The four corners are marked with scales and direction marks. The scales help set the support for chips of different thicknesses, while the direction marks quickly distinguish the methods for up and down movement.
• A built-in screw lock secures the turntable, preventing accidental touches that could cause the fixed chip to fall off.
• A built-in unique hidden tin ball pouring slot design allows for quick and convenient disposal of excess tin balls.

Stencils Specifications

iPhone A8-A17 CPUs (10 pcs.)

• A8, A9, A10, A11, A12, A13, A14, A15, A16, A17 CPU RAM
  • iPhone 6 / 6 Plus / 6S / 6S Plus
  • iPhone 7 / 7 Plus
  • iPhone 8 / 8 Plus
  • iPhone X / XS / XS Max / XR
  • iPhone 11 / 11 Pro / 11 Pro Max
  • iPhone 12 mini / 12 / 12 Pro / 12 Pro Max
  • iPhone 13 mini / 13 / 13 Pro / 13 Pro Max
  • iPhone 14 / 14 Plus / 14 Pro / 14 Pro Max
  • iPhone 15 / 15 Plus / 15 Pro / 15 Pro Max
• Size: 65.4 mm x 65.4 mm
• Stencil net thickness: 0.12 mm
• Square holes and rounded corners

Qualcomm Snapdragon Series CPUs (21 pcs.)

• RB03-QT 1 - Qualcomm Snapdragon 210 MSM8909
• RB03-QT 2 - Qualcomm Snapdragon 410 MSM8916,615 MSM8939
• RB03-QT 3 - Qualcomm Snapdragon 425 MSM8917
• RB03-QT 4 - Qualcomm Snapdragon 430 MSM8937, 435 MSM8940
• RB03-QT 5 - Qualcomm Snapdragon 460 SM4250, 662 SM6115
• RB03-QT 6 - Qualcomm Snapdragon 625 MSM8953 1AB
• RB03-QT 7 - Qualcomm Snapdragon SDM450/632 MSM8953 B01
• RB03-QT 8 - Qualcomm Snapdragon 636 SDM636, 660 SDM660
• RB03-QT 9 - Qualcomm Snapdragon 765G SM7250
• RB03-QT 10 - Qualcomm Snapdragon 778G SM7315/7325
• RB03-QT 11 - Qualcomm Snapdragon 820 MSM8996
• RB03-QT 12 - Qualcomm Snapdragon 835 MSM8998
• RB03-QT 13 For Qualcomm Snapdragon 845 SMD845
• RB03-QT 14 - Qualcomm Snapdragon 855 SM8150
• RB03-QT 15 - Qualcomm Snapdragon 865/870 SM8250-002 Big
• RB03-QT 16 - Qualcomm Snapdragon 865 SM8250-102 Small
• RB03-QT 17 - Qualcomm Snapdragon 888 SM8350
• RB03-QT 18 - Qualcomm Snapdragon 888 SM8350 Anti-short circuit net
• RB03-QT 19 - Qualcomm Snapdragon 8Gen1 SM8450
• RB03-QT 20 - Qualcomm Snapdragon 8Gen2 SM8550
• RB03-QT 21 - Qualcomm Snapdragon 7+Gen2 SM7475, 8+Gen1 SM8475/8425

• Size: 65.4 mm x 65.4 mm
• Stencil net thickness: 0.12 mm
• Square holes and rounded corners

Hisilicon Kirin Series CPUs (18 pcs.)

• RB03-HI 1 - Hisilicon Kirin 620 HI6220
• RB03-HI 2 - Hisilicon Kirin 659 HI6250
• RB03-HI 3 - Hisilicon Kirin 710 HI6260 V100
• RB03-HI 4 - Hisilicon Kirin 710 HI6260 V101
• RB03-HI 5 - Hisilicon Kirin 810 HI6280
• RB03-HI 6 - Hisilicon Kirin 820/985 HI6290/L
• RB03-HI 7 - Hisilicon Kirin 960 HI3660
• RB03-HI 8 - Hisilicon Kirin 970 HI3670
• RB03-HI 9 - Hisilicon Kirin 980 HI3680
• RB03-HI 10 - Hisilicon Kirin 990 HI3690 5G
• RB03-HI 11 - Hisilicon Kirin HI9500 V100
• RB03-HI 12 - Hisilicon Kirin 9000 HI36A0
• RB03-HI 13 - Hisilicon Kirin 9000S HI36A0-V120
• RB03-HI 14 - Hisilicon HI6260 RAM
• RB03-HI 15 - Hisilicon HI3660 RAM
• RB03-HI 16 - Hisilicon HI3670/80/90 RAM
• RB03-HI 17 - Hisilicon HI36A0 RAM
• RB03-HI 18 - Hisilicon Kirin 990 HI3690 4G

• Size: 65.4 mm x 65.4 mm
• Stencil net thickness: 0.12 mm
• Square holes and rounded corners

MTK Dimensity Series CPUs (10 pcs.)

• RB03-MT 1 - MTK Dimensity MT6768V/6769V
• RB03-MT 2 - MTK Dimensity 700/810 MT6833V
• RB03-MT 3 - MTK Dimensity 720 MT6853V
• RB03-MT 4 - MTK Dimensity 800 MT6873V, 820 MT6875V
• RB03-MT 5 - MTK Dimensity 900/1080 MT6877V
• RB03-MT 6 - MTK Dimensity 1000 MT6889Z, 1000L MT6885Z
• RB03-MT 7 - MTK Dimensity 1100 MT6891Z, 1200 MT6893Z
• RB03-MT 8 - MTK Dimensity 8100 MT6895Z
• RB03-MT 9 - MTK Dimensity 9000 MT6983Z
• RB03-MT 10 - MTK Dimensity 9200 MT6985W

• Size: 65.4 mm x 65.4 mm
• Stencil net thickness: 0.12 mm
• Square holes and rounded corners

Samsung Exynos Series CPUs (10 pcs.)

• RB03-EX 1 - Samsung Exynos 2100
• RB03-EX 2 - Samsung Exynos 2200/E9925
• RB03-EX 3 - Samsung Exynos 7884/7885/7904
• RB03-EX 4 - Samsung Exynos 880/980
• RB03-EX 5 - Samsung Exynos 8895
• RB03-EX 6 - Samsung Exynos 9609
• RB03-EX 7 - Samsung Exynos 9610/9611
• RB03-EX 8 - Samsung Exynos 9815/1080
• RB03-EX 9 - Samsung Exynos 9820
• RB03-EX 10 - Samsung Exynos 990

• Size: 65.4 mm x 65.4 mm
• Stencil net thickness: 0.12 mm
• Square holes and rounded corners

EMMC UFS (7 pcs.)

• EMMC EMCP UFS BGA153, BGA162, BGA169, BGA186, BGA221, BGA254, BGA297 all sizes
• Size: 65.4 mm x 65.4 mm
• Stencil net thickness: 0.12 mm
• Square holes and rounded corners

Universal BGA (7 pcs.)

• P:0.3 50X50: Spacing:0.3
• P:0.35 50X50: Spacing:0.35
• P:0.4 50X50: Spacing:0.4
• P:0.5 50X50: Spacing:0.5
• P:0.35 45° 50X50: Spacing:0.35
• P:0.4 45° 50X50: Spacing:0.4
• P:0.4 D 50X50: Spacing:0.4

• Size: 63 mm x 63 mm
• Stencil net thickness: 0.12 mm
• Square holes and rounded corners

0.5-1.5MM Universal (12 pcs.)

This stencils are used for Soldering Balls

• 0.25MM P:0.5: Solder Balls size: 0.25mm Spacing:0.5
• 0.3MM P:0.58: Solder Balls size: 0.3mm Spacing:0.58
• 0.35MM P:0.65: Solder Balls size: 0.35mm Spacing:0.65
• 0.4MM P:0.7: Solder Balls size: 0.4mm Spacing:0.7
• 0.45MM P:0.78: Solder Balls size: 0.45mm Spacing:0.78
• 0.5MM P:0.8: Solder Balls size: 0.5mm Spacing:0.8
• 0.55MM P:1.02: Solder Balls size: 0.55mm Spacing:1.02
• 0.6MM P:0.9: Solder Balls size: 0.6mm Spacing:0.9
• 0.6MM P:1.0: Solder Balls size: 0.6mm Spacing:1.0
• 0.6MM P:1.1: Solder Balls size: 0.6mm Spacing:1.1
• 0.76MM P:1.27: Solder Balls size: 0.76mm Spacing:1.27
• 1.0MM P:1.5: Solder Balls size: 1.0mm Spacing:1.5

• Size: 63 mm x 63 mm
• Stencil net thickness: 0.2 mm
• Circular hole

Package Contents:

• RB-03 Universal BGA Reballing Platform - 1 pc.
• Stencil nets - 95 pcs.