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RELIFE SP-50 BGA IC Solder Paste
RELIFE SP-50 BGA IC Solder Paste
Regular price
PKR 500.00
Regular price
PKR 850.00
Sale price
PKR 500.00
Unit price
per
Weight : 0.2 kg
Shipment Delivery Time!
Shipment Delivery Time!
Shipment delivery time is 1 to 7 business days.
NOTE! Purchase of all physical product is generally processed within 1 business day after we received your payment in full.
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Shipment Delivery Time!
Shipment Delivery Time!
Shipment delivery time is 1 to 7 business days.
NOTE! Purchase of all physical product is generally processed within 1 business day after we received your payment in full.
Increase productivity and efficiency with RELIFE SP-50 BGA IC Solder Paste. Our scientifically formulated paste provides reliable and secure bonding for BGA IC components. With its high-quality composition, experience smooth and precise application, resulting in strong and durable solder connections.
